Fundamental Study on Precision Ultrasonic Vibration Polishing
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Author list: Hakuto Nakano*, Peerapong Kasuriya, Hidenari Kanai, Masahiko Jin
Publisher: Trans Tech Publications
Publication year: 2025
Journal: Key Engineering Materials (1013-9826)
Volume number: 1008
Start page: 43
End page: 48
Number of pages: 6
ISSN: 1013-9826
eISSN: 1662-9795
URL: https://www.scientific.net/KEM.1008.43
Abstract
The effectiveness of ultrasonic vibration polishing, a polishing method in which an abrasive wheel is vibrated perpendicular to the polishing direction, was investigated. A 3mm diameter cBN abrasive electroplated wheel (#800) was used as the abrasive wheel, and it was vibrated at a frequency of 38kHz and a maximum amplitude of 5.0µm (0-p). Truncation was also performed to make the abrasive grain height of the wheel uniform. Two types of truncation were performed: film lapping and PCD lapping, and the effects of truncation were investigated. Polishing experiments were performed on SKH51, and a comparison was made with conventional polishing and the effects of truncation. The results showed that ultrasonic vibration polishing using a truncated wheel improved the polishing efficiency and surface roughness.
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