Fundamental Study on Precision Ultrasonic Vibration Polishing

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Author listHakuto Nakano*, Peerapong Kasuriya, Hidenari Kanai, Masahiko Jin

PublisherTrans Tech Publications

Publication year2025

JournalKey Engineering Materials (1013-9826)

Volume number1008

Start page43

End page48

Number of pages6

ISSN1013-9826

eISSN1662-9795

URLhttps://www.scientific.net/KEM.1008.43


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Abstract

The effectiveness of ultrasonic vibration polishing, a polishing method in which an abrasive wheel is vibrated perpendicular to the polishing direction, was investigated. A 3mm diameter cBN abrasive electroplated wheel (#800) was used as the abrasive wheel, and it was vibrated at a frequency of 38kHz and a maximum amplitude of 5.0µm (0-p). Truncation was also performed to make the abrasive grain height of the wheel uniform. Two types of truncation were performed: film lapping and PCD lapping, and the effects of truncation were investigated. Polishing experiments were performed on SKH51, and a comparison was made with conventional polishing and the effects of truncation. The results showed that ultrasonic vibration polishing using a truncated wheel improved the polishing efficiency and surface roughness.


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Last updated on 2025-20-03 at 00:00