Development of a self-vibrating ultrasonic grinding wheel 3rd report: Relationship between compression force to PZT and vibration characteristics

The jigs used to manufacture semiconductor substrates are made of fine ceramics such as Al2O3 and polycrystalline SiC, and are difficult to cut because of their high hardness. Furthermore, these jigs are large, with diameters of 300 mm or more, and generally require long processing times and contain many fine shapes. In other words, they are difficult-to-cut material and have difficult-to-cut shapes. The ultrasonic vibration-assisted grinding method is considered to be effective for processing these semiconductor substrate manufacturing jigs. In other words, by using ultrasonic vibration in the grinding process, it is expected that the grinding efficiency will be improved by promoting crushing, preventing clogging, and promoting the coolant effect. However, in order to use ultrasonic vibration grinding, a dedicated grinding device and grinding wheel are required, so the current situation is that there are high hurdles to using it. In this study, we are considering developing a grinding wheel that can ultrasonically vibrate itself so that it can be attached to a general-purpose grinding spindle. In this paper, we investigated the relationship between the pressure and vibration characteristics of PZT when incorporating PZT into a grinding metal base.