Feasibility of Contactless Superconductor Levitation for Micro-Assembly Handling: Simulation Experiments

This study investigates the feasibility of superconducting levitation for high-precision, contactless micro-assembly. Challenges in microscale manipulation, including dominant surface forces and contamination risks, necessitate innovative approaches. Using MATLAB-based dynamic simulations, we analyzed the stability, force capacity, and dynamic response of a type II superconductor levitation system, modeling flux pinning, PID-controlled positioning, and environmental disturbances. Results demonstrate excellent steady-state precision, robust disturbance rejection, and a well-defined operational load margin. Compared to acoustic and electromagnetic methods, superconducting levitation offers superior passive stability and precision, though it requires complex cryogenic operation. Technology readiness stands at TRL 2–3, with key barriers identified in cooling integration and environment sensitivity. This work establishes a quantitative foundation for advancing superconducting levitation in micro-assembly, highlighting the need for further experimental validation and integration for industrial application.