Detection of Wire Lift-Off in Si-IGBTs and
SiC-MOSFETs Using Machine Learning
on Switching Waveforms
บทความในวารสาร
ผู้เขียน/บรรณาธิการ
กลุ่มสาขาการวิจัยเชิงกลยุทธ์
รายละเอียดสำหรับงานพิมพ์
รายชื่อผู้แต่ง: KAZUNE IDEI, THATREE MAMEE, HAUKE LUTZEN, NANDO KAMINSKI, KATSUHIRO HATA, MAKOTO TAKAMIYA, SHIN-ICHI NISHIZAWA, WATARU SAITO
ผู้เผยแพร่: Institute of Electrical and Electronics Engineers
ปีที่เผยแพร่ (ค.ศ.): 2026
ชื่อย่อของวารสาร: IEEE Open Journal of Power Electronics
Volume number: Volume: 7
นอก: 2644-1314
eISSN: 2644-1314
URL: https://ieeexplore.ieee.org/document/11414118
ภาษา: English-United States (EN-US)
บทคัดย่อ
ABSTRACT Power cycling degradation in power modules is one of the most common failure modes in power electronic systems. This study presents a method to detect wire lift-off using machine learning analysis of switching waveforms of gate voltage and emitter/source current in Si-IGBT and SiC-MOSFET power modules. Five key aspects are investigated as follows: (1) evaluation of different detection signals and their combinations, (2) segment-wise analysis to identify waveform regions that contribute most to classification, (3) impact of waveform sampling rate on detection accuracy, (4) validation using mixed datasets from multiple modules, and (5) comparison between Si-IGBT and SiC-MOSFET devices. The turn-off gate voltage waveforms provide the highest accuracy, and a high accuracy of about 99 % was achieved even with downsampling from 2.5 GS/s to 100 MS/s. The mixed datasets show no degradation in accuracy, and the optimum gate drive condition for high accuracy differs between Si-IGBTs and SiC-MOSFETs. Overall, the proposed method achieves over 99 % classification accuracy, demonstrating its potential for reliable and low-cost monitoring of power device degradation.
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