On the thermal cooling of central processing unit of the PCs with vapor chamber
Journal article
Authors/Editors
Strategic Research Themes
No matching items found.
Publication Details
Author list: Naphon P., Wongwises S., Wiriyasart S.
Publisher: Elsevier
Publication year: 2012
Journal: International Communications in Heat and Mass Transfer (0735-1933)
Volume number: 39
Issue number: 8
Start page: 1165
End page: 1168
Number of pages: 4
ISSN: 0735-1933
eISSN: 1879-0178
Languages: English-Great Britain (EN-GB)
View in Web of Science | View on publisher site | View citing articles in Web of Science
Abstract
An experimental investigation on the thermal cooling of vapor chamber for cooling computer processing unit of the personal computer is performed. Two different configurations of the vapor chambers with de-ionized water as working fluid are tested under the real operating conditions of PCs. Parametric studies including different aspect ratios, fill ratios, and operating conditions of PC on the CPU temperature are considered. It was found that the vapor chamber cooling technique has significant effect on the thermal cooling of CPU. Average CPU temperatures obtained from the vapor chamber cooling system are 4.1%, 6.89% lower than those from the conventional cooling system for no load and 90% operating loads, respectively. In additional, this cooling system requires 6.89%, 10.53% lower energy consumption for no load and 90% operating loads, respectively. The results of this study are of technological importance for the efficient design of cooling systems of the personal computers or electronic devices to enhance cooling performance. ฉ 2012 Elsevier Ltd.
Keywords
Central processing unit, Electronics cooling, Vapor chamber
Contact Information