Experimental investigation and optimization of micro-EDMing process for silicon substrates
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Author list: Tangwarodomnukun V., Visonsaya P., Buranajant N., Opartpunyasarn M., Dumkum C.
Publisher: Taylor and Francis Group
Publication year: 2015
Journal: Materials and Manufacturing Processes (1042-6914)
Volume number: 30
Issue number: 8
Start page: 974
End page: 982
Number of pages: 9
ISSN: 1042-6914
eISSN: 1532-2475
Languages: English-Great Britain (EN-GB)
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Abstract
Microelectrical discharge machining of n-type monocrystalline silicon is investigated in this study through a microgrooving process. The pulse duration, pulse frequency, spark current, and gap voltage are varied in the experiments. The groove geometries and roughness are measured together with the material removal rate and electrode wear ratio. The results have shown that a large and deep groove can be made at high machining rate when a high spark energy condition is applied. This can, however, increase the electrode wear ratio as a consequence, making the process inefficient. A multiresponse optimization, using Grey relational analysis, has been applied. The optimum cut result has shown that good cut quality, high material removal rate, and low electrode wear ratio are achievable from this study. ฉ Taylor & Francis Group,LsLC.
Keywords
EDM, Electro-discharge, Grey-relational, Grooving, Micro-EDM
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