Antireflective Surface of Nanostructures Fabricated by CF4 Plasma Etching

บทความในวารสาร


ผู้เขียน/บรรณาธิการ


กลุ่มสาขาการวิจัยเชิงกลยุทธ์

ไม่พบข้อมูลที่เกี่ยวข้อง


รายละเอียดสำหรับงานพิมพ์

รายชื่อผู้แต่งSomrang, Witchaphol;Denchitcharoen, Somyod;Eiamchai, Pitak;Horprathum, Mati;Chananonnawathorn, Chanunthorn

ปีที่เผยแพร่ (ค.ศ.)2017

วารสารJournal of Metals, Materials and Minerals (0857-6149)

Volume number27

Issue number1

หน้าแรก39

หน้าสุดท้าย45

นอก0857-6149

URLhttp://ojs.materialsconnex.com/index.php/jmmm/article/view/332/404


บทคัดย่อ

In this research, the nanostructures surface was fabricated by the CF4 plasma etching process on the SiO2-based substrates for antireflection applications. The nickel films were firstly deposited on the substrates by the sputtering system. The prepared Ni layers were then annealed at 500C for 1 min in order to promote dewetting process to be used as metal masks. During the etching process, CF4 etching condition was performed for 15-60 min. to create the SiO2 nanopillars. After the etching process, the samples were immersed in nitric acid for 5 min. to remove the nickel masks. The SiO2 nanopillars without Ni were investigated for physical morphologies and optical properties by the field-emission scanning electron microscopy (FESEM) and UV-Vis-NIR spectroscopy respectively. The results showed that the etching conditions greatly affected the sizes and shapes of the nanostructures, as well as improved the antireflection properties of the SiO2 based materials.


คำสำคัญ

AntireflectionDewettingPlasma etching.


อัพเดทล่าสุด 2022-06-01 ถึง 15:34