Analysis of bending mechanism and spring-back characteristics in the offset Z-bending process

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Author listThipprakmas S., Komolruji P.

PublisherSpringer

Publication year2016

JournalInternational Journal of Advanced Manufacturing Technology (0268-3768)

Volume number85

Issue number#

Start page2589

End page2596

Number of pages8

ISSN0268-3768

eISSN1433-3015

URLhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84947600546&doi=10.1007%2fs00170-015-8127-6&partnerID=40&md5=cf9d30a39d724ac4169ee77bc1b7915a

LanguagesEnglish-Great Britain (EN-GB)


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Abstract

The Z-bending process has rarely been investigated because Z-shaped parts can be fabricated by applying two bending steps through V-bending processes. In recent years, the Z-bending process has been increasingly applied to reduce the number of processing steps and fabrication time. However, the number of studies on this process is still lacking, which means there is still difficulty with die and process designs when attempting to control the spring-back/spring-forward characteristics. In this study, to solve these problems, the offset Z-bending process was examined using the finite element method (FEM) and laboratory experiments. Based on the stress distribution analysis, the bending mechanism was investigated and clearly identified by analyzing changes in the stress distribution; the analysis showed that the theories of V-bending processes could not be used for the offset Z-bending process. This study also suggests that for the offset Z-bending process, in which the punch is moveable and the die is fixed, the amount of spring-back should not be equal to each other. In addition, the effects of the bend angle on the spring-back/spring-forward characteristics were investigated and clearly identified by analyzing the changes in the stress distribution. Based on the laboratory experiments, the FEM simulation results showed good agreement in terms of both the bend angles and bending forces. ฉ 2015, Springer-Verlag London.


Keywords

OffsetSpring-forward


Last updated on 2023-23-09 at 07:36