An elastic model of DNA under thermal induced stress
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Publication Details
Author list: Liangruksa M., Wongwises S.
Publisher: Elsevier
Publication year: 2018
Journal: Mathematical Biosciences (0025-5564)
Volume number: 300
Start page: 47
End page: 54
Number of pages: 8
ISSN: 0025-5564
eISSN: 1879-3134
Languages: English-Great Britain (EN-GB)
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Abstract
DNAs (deoxyribonucleic acids) have the ability to alter its conformation in response to temperature changes to relieve the internal stress. The mistakenly structured DNA can lead to diseases or deformities. The conformation also influences the binding between DNA and other molecular complexes. In the present paper, we investigate the DNA elasticity under the influence of thermal induced stress by employing Kirchhoff's model of a thin elastic rod. The problem is solved by perturbation method to find equilibrium configurations of DNA at different modes. In addition, the model is validated with existing literature in which DNA is stretched or compressed. The behaviors of the helical structure under various temperatures are investigated with the melting temperature of DNA around 80 ฐC. This elasticity study of DNA could be a groundwork leading to better understandings on the effects of thermal induced stress to DNA's deformation and relevant biological processes in living cells. ฉ 2018 Elsevier Inc.
Keywords
Kirchhoff's model, Thermal induced stress
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