Crack reduction in tabbing and stringing processes for solar cells

Conference proceedings article

ผู้เขียน/บรรณาธิการ

กลุ่มสาขาการวิจัยเชิงกลยุทธ์

ไม่พบข้อมูลที่เกี่ยวข้อง

รายละเอียดสำหรับงานพิมพ์

รายชื่อผู้แต่ง: Kongwiriyaphaisan A., Tangwarodomnukun V.

ผู้เผยแพร่: Trans Tech Publications

ปีที่เผยแพร่ (ค.ศ.): 2018

Volume number: 777 KEM

หน้าแรก: 126

หน้าสุดท้าย: 131

จำนวนหน้า: 6

ISBN: 9783035713718

นอก: 1013-9826

eISSN: 1662-9795

URL: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85054829376&doi=10.4028%2fwww.scientific.net%2fKEM.777.126&partnerID=40&md5=31ed4d85a228782f0741cdea79a14418

ภาษา: English-Great Britain (EN-GB)

ดูบนเว็บไซต์ของสำนักพิมพ์

บทคัดย่อ

Wafer cracking is considered to be an important loss in solar cell manufacturing as it crucially affects the production yield as well as the efficiency of solar cells fabricated. There is a certain chance of cracking in wafer when the substrate undergoes some thermal and/or mechanical loads during its fabrication. This research therefore aims to decrease the solar cells cracking in tabbing and stringing processes as the two processes are responsible for a great number of cracks in the substrate. A set of experiments was performed in this study, where soldering temperature and time were tested and the amount of cracks in solar cells was quantified. The findings showed that the use of 185ฐC soldering temperature with the soldering time of 1, 200 ms can reduce the number of cracks in the tabbing and stringing of silicon solar cells. With this setup, the adhesion force between tabbing ribbons and substrate surface can also be promoted, thus preventing the delamination problem in the cell panels. ฉ 2018 Trans Tech Publications, Switzerland.

คำสำคัญ

Soldering, Tabbing