Thermal performance of plate fin heat sink combined with copper foam
Journal article
Authors/Editors
Strategic Research Themes
No matching items found.
Publication Details
Author list: Nilpueng K., Amani J., Dalkilic A.S., Asirvatham L.G., Mahian O., Wongwises S.
Publisher: Begell House Inc.
Publication year: 2019
Volume number: 50
Issue number: 16
Start page: 1595
End page: 1613
Number of pages: 19
ISSN: 1064-2285
eISSN: 1064-2285
Languages: English-Great Britain (EN-GB)
View in Web of Science | View on publisher site | View citing articles in Web of Science
Abstract
This paper presents the experimental investigation and comparison of thermal performance of plate fi n heat sinks combined with copper foam, fl at plate heat sinks combined with copper foam, and plate fi n heat sinks. The eff ect of air velocity, pore density of the copper foam, and heat fl ux on thermal resistance and pressure drop is investigated. The experiments are carried out at air velocity ranging between 1 m/s and 5 m/s and heat fl ux ranging between 9.48 kW/m2 and 12.59 kW/m2. Copper foams with similar porosity and diff erent pore density of 30 PPI, 40 PPI, and 50 PPI are used. The experimental results showed that the thermal resistance of PFHSfoam and FPHSfoam is decreased by 13.57% and 10.89% when the pore density increases at a low mass fl ux (G = 2.89 kg/m2ทs for PFHSfoam and G = 3.88 kg/m2ทs for FPHSfoam). However, at a high mass fl ux (G > 2.89 kg/m2ทs for PFHSfoam and G > 3.88 kg/m2ทs for FPHSfoam), it is decreased by 7.97% and 4.39%. The thermal resistance of PFHS, PFHSfoam, and FPHSfoam changes slightly by the varying heat fl ux. The total pressure drop of PFHSfoam and FPHSfoam increases by about 1.72 times and 2.02 times on increase in the pore density between 30 PPI and 50 PPI. Under a similar pumping power, PFHSfoam gives the lowest thermal resistance, and thermal resistance of PFHSfoam and FPHSfoam is lower than that from PFHS by about 40.74% and 25.18%. ฉ 2018 by Begell House, Inc.
Keywords
Pore density
Contact Information