Stress field modeling of single-abrasive scratching of BK7 glass for surface integrity evaluation

Journal article


Authors/Editors


Strategic Research Themes


Publication Details

Author listWeiping Hu, Qi Teng, Tao Hong, Viboon Saetang, Huan Qi

PublisherElsevier

Publication year2022

JournalCeramics International (0272-8842)

Volume number48

Issue number9

ISSN0272-8842

eISSN1873-3956

URLhttps://www.sciencedirect.com/science/article/pii/S0272884222001687?via%3Dihub


View in Web of Science | View on publisher site | View citing articles in Web of Science


Abstract

This paper presents a numerical and experimental study on the single-abrasive scratching of BK7 glass. The
formation mechanisms of cracks are investigated for surface integrity evaluation to improve the processing efficiency
and ensure surface quality through the inhibition of surface and subsurface damage. The numerical
simulation reveals that as the abrasive gradually scratches the target surface, median cracks nucleate at the
current position just beneath the abrasive, while symmetrical radial cracks that propagate along the negative
direction of the x-axis along the scratching direction are easily nucleated slightly behind the abrasive. The singleabrasive
scratching experiments at gradually increasing depths on BK7 glass indicate that as the scratching speed
increases, the plastic machinability and machining quality are significantly improved. The predicted nucleation
position and propagation direction of the radial cracks on the target surface agree well with the corresponding
experimental results. Thus, this study can provide a reference for the actual fabrication of high-value BK7 glass
devices with high efficiency and quality.


Keywords

BK7 glassSingle-abrasive scratchingStress field modelSurface Integrity


Last updated on 2023-04-10 at 10:10