LASER TEXTURING PROCESS ON THE SURFACE PROPERTIES OF SILICON WAFER
Journal article
Authors/Editors
Strategic Research Themes
Publication Details
Author list: Tangwarodomnukun V., Moolsradoo N.
Publisher: -
Publication year: 2022
Journal acronym: -
Volume number: 29
Issue number: 1
ISSN: 0858-849X
eISSN: 2587-0009
Languages: English-Great Britain (EN-GB)
Abstract
A silicon wafer modification induced by laser texturing process was investigated in this paper to understand the influence of laser power and laser scanning speed on its surface characteristics. The morphology and chemical compositions of the wafer were observed and characterized by using the scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS), respectively. The corrosion potential of laser-scanned wafer was assessed by using potentiodynamic polarization. In addition, the obtained surface roughness was measured by using a surface profiler. Ball-on-disk friction test was employed to quantify the friction coefficient of laser-textured surface. The results indicate that with the increasing laser power at scanning speeds of 10 mm/s, corrosion resistance increases. The laser power of 25 W shows the highest corrosion potential value (Ecorr) of -0.61 V, indicating good corrosion resistance property. Increasing laser power tends to increase surface roughness and the friction coefficient. © 2022
Keywords
Laser texturing, silicon wafer
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