A deep AlTiC dry etching for fabrication of Burnish and Glide slider head

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Publication Details

Author list: Pakpum C., Limsuwan P.

Publisher: Elsevier

Publication year: 2012

Volume number: 32

Start page: 1037

End page: 1042

Number of pages: 6

ISSN: 1877-7058

URL: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84892624335&doi=10.1016%2fj.proeng.2012.02.051&partnerID=40&md5=4cc1cc35b902b8be518730b28e85985e

Languages: English-Great Britain (EN-GB)

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Abstract

As a commercial photolithography dry film is not possible to achieve a very deep (greater than 30μm) step etch, to fabricate Burnish head and Glide head in slider fabrication section of hard disk drive industry, by dry etching of ceramic Al2O3-TiC material due to the low etch selectivity of substrate to dry film mask. This paper aim to investigate the etch selectivity of substrate to hard metal mask which have high potential that significantly to increase the etch selectivity allowable to produce the 30 μm AlTiC etch depth and etch rate of the two type of fluorine-based plasma; SF6 plasma versus CF4 plasma are also explored. © 2010 Published by Elsevier Ltd.

Keywords

Burnish head, Glide head, RIE