Optimization of hybrid laser-waterjet micromachining of silicon
Conference proceedings article
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Publication Details
Author list: Tangwarodomnukun V., Wang J.
Publisher: Trans Tech Publications
Publication year: 2013
Volume number: 797
Start page: 3
End page: 8
Number of pages: 6
ISBN: 9783037858257
ISSN: 1022-6680
eISSN: 1662-8985
Languages: English-Great Britain (EN-GB)
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Abstract
Micro/nano-fabrication with less damage has been raised as a challenging issue in advanced micro/nano-manufacturing industries. Recently, a new hybrid laser-waterjet machining technology has been developed, in which material is removed by laser heating and softening and waterjet cooling and expelling with negligible thermal damage to the workpiece. An optimization of the process parameters, such as laser pulse energy, laser pulse overlap, focal plane position, and waterjet offset distance, in the machining of silicon using this hybrid technology is presented in this study. Grey relational analysis based on an orthogonal array is employed to optimize the multiperformance characteristics, where the groove width and heat-affected zone are minimized while the groove depth is maximized. ฉ (2013) Trans Tech Publications, Switzerland.
Keywords
Laser, Micromachining, Waterjet
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