Bismuth formation in lead-free CuZnSi yellow brass with various bismuthtin alloy additions
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Author list: Suksongkarm P., Rojananan S.
Publisher: Nihon Kinzoku Gakkai (日本金属学会)
Publication year: 2018
Journal: Materials Transactions (1345-9678)
Volume number: 59
Issue number: 11
Start page: 1747
End page: 1752
Number of pages: 6
ISSN: 1345-9678
Languages: English-Great Britain (EN-GB)
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Abstract
Typically, bismuth added in traditional CuZn brass segregates as films or particles along the alpha-beta phase boundary and induces cracks after casting. The present work investigated the bismuth formation in lead-free CuZnSi yellow brass with various amounts of recycled bismuthtin (BiSn) solder. The results showed that no bismuth film segregated at the phase boundaries. In contrast, round particles of bismuth formed in the beta phase and at the alpha-beta phase boundaries when added 1 mass% BiSn alloy and the bismuth particles embedded only in the alpha phase when added 2 to 4 mass% BiSn alloy, respectively. The morphology of the fracture surfaces was significantly modified when BiSn alloy content was increased. More importantly, there was no crack observed in as-cast samples and samples did not subject to any heat treatment process unlike the bismuth formation in other work. Thus, this work suggests that the addition of recycled BiSn solder in lead-free CuZnSi yellow brass is beneficial to avoid cracks in castings and offer an original lead-free brass alloy with superior properties. ฉ 2018 The Japan Institute of Metals and Materials.
Keywords
Bismuthtin solder, Fracture behavior
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