Fabrication processes of soi structure for optical nonreciprocal devices

Conference proceedings article

Authors/Editors

Strategic Research Themes

No matching items found.

Publication Details

Author list: Choowitsakunlert S., Takagiwa K., Kobashigawa T., Hosoya N., Silapunt R., Yokoi H.

Publisher: Trans Tech Publications

Publication year: 2018

Volume number: 777 KEM

Start page: 107

End page: 112

Number of pages: 6

ISBN: 9783035713718

ISSN: 1013-9826

eISSN: 1662-9795

URL: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85054883079&doi=10.4028%2fwww.scientific.net%2fKEM.777.107&partnerID=40&md5=7982f9a8a1beaf640ad7e85b2e5bc8e4

Languages: English-Great Britain (EN-GB)

View on publisher site

Abstract

Fabrication processes of a magneto-optic waveguide with a Si guiding layer for an optical isolator employing a nonreciprocal guided-radiation mode conversion are investigated. The optical isolator is constructed on a silicon-on-insulator (SOI) structure. The magneto-optic waveguide is fabricated by bonding the Si guiding layer with a cerium-substituted yttrium iron garnet (Ce: YIG). The relationship of waveguide geometric parameters is determined at a wavelength of 1550 nm. The results show that larger tolerance for isolator operation can be obtained at smaller gaps between Si and Ce: YIG. Bonding processes including photosensitive adhesive bonding and surface activated bonding are then compared. It is found that the surface activated bonding process is easier to control and more promising than the photosensitive adhesive bonding. ฉ 2018 Trans Tech Publications, Switzerland.

Keywords

Photosensitive adhesive bonding, Silicon-on-insulator (SOI), Surface activated bonding