Photosensitive adhesive bonding process of magnetooptic waveguides with Si guiding layer for optical nonreciprocal devices
Journal article
Authors/Editors
Strategic Research Themes
No matching items found.
Publication Details
Author list: Choowitsakunlert S., Takagiwa K., Kobashigawa T., Hosoya N., Silapunt R., Yokoi H.
Publisher: IOP Publishing
Publication year: 2018
Journal: Japanese Journal of Applied Physics (0021-4922)
Volume number: 57
Issue number: 5
ISSN: 0021-4922
eISSN: 1347-4065
Languages: English-Great Britain (EN-GB)
View in Web of Science | View on publisher site | View citing articles in Web of Science
Abstract
A photosensitive adhesive bonding process for a magnetooptic waveguide for an optical isolator employing a nonreciprocal guided-radiation mode conversion is investigated at 1.55 ตm. The magnetooptic waveguide is a straight rib type, and it is fabricated by bonding the Si guiding layer to a magnetic garnet. In the fabrication process, an adhesive material is diluted to obtain a certain thickness before depositing on a silicon-on-insulator (SOI) substrate. The relationship between the percent dilution ratio and the thickness of the adhesive layer is considered. The smallest gap thickness is found to be 0.66 ตm at a dilution ratio of 2%. ฉ 2018 The Japan Society of Applied Physics.
Keywords
No matching items found.
Contact Information