Reduction of Escherichia coli adhesion to AISI 316L stainless steel surface by using mechanical and electrochemical polishing processes
บทความในวารสาร
ผู้เขียน/บรรณาธิการ
กลุ่มสาขาการวิจัยเชิงกลยุทธ์
รายละเอียดสำหรับงานพิมพ์
รายชื่อผู้แต่ง: Chotchutiphong T., Tangwarodomnukun V.
ผู้เผยแพร่: Taylor and Francis Group
ปีที่เผยแพร่ (ค.ศ.): 2021
วารสาร: The Journal of Adhesion (0021-8464)
Volume number: 97
Issue number: 15
หน้าแรก: 1440
หน้าสุดท้าย: 1455
จำนวนหน้า: 16
นอก: 0021-8464
eISSN: 1545-5823
ภาษา: English-Great Britain (EN-GB)
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บทคัดย่อ
This paper presents the role of surface roughness on the bacterial adhesion to the food-grade AISI 316L stainless steel surface, which was prepared by the mechanical and electrochemical polishing processes. Escherichia coli or E. coli was the bacteria tested in this study as it is a sanitization indicator in the food and pharmaceutical industries. The average surface roughness (Ra), peak-to-valley roughness (Ry), and five-point average roughness (Rz) of the polished surface were measured, and the results demonstrated that the amount of E. coli was found to increase with the increased surface roughness. As per the electrochemical polishing process, the effects of applied voltage, electrolyte concentration, and polishing time on the three roughness parameters were examined. Besides the Ra, the influence of Ry and Rz on the bacterial adhesion was found to be very significant. By using the electrochemical process with a suitable polishing condition, the Ry and Rz were substantially reduced compared to the mechanically polished surface with the similar level of Ra. The amount of bacteria on the electrochemically polished surface was also lower than the mechanical one by 25% on average. © 2020, © 2020 Taylor & Francis Group, LLC.
คำสำคัญ
electrochemical polishing
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