Reduction of Escherichia coli adhesion to AISI 316L stainless steel surface by using mechanical and electrochemical polishing processes
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Publication Details
Author list: Chotchutiphong T., Tangwarodomnukun V.
Publisher: Taylor and Francis Group
Publication year: 2021
Journal: The Journal of Adhesion (0021-8464)
Volume number: 97
Issue number: 15
Start page: 1440
End page: 1455
Number of pages: 16
ISSN: 0021-8464
eISSN: 1545-5823
Languages: English-Great Britain (EN-GB)
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Abstract
This paper presents the role of surface roughness on the bacterial adhesion to the food-grade AISI 316L stainless steel surface, which was prepared by the mechanical and electrochemical polishing processes. Escherichia coli or E. coli was the bacteria tested in this study as it is a sanitization indicator in the food and pharmaceutical industries. The average surface roughness (Ra), peak-to-valley roughness (Ry), and five-point average roughness (Rz) of the polished surface were measured, and the results demonstrated that the amount of E. coli was found to increase with the increased surface roughness. As per the electrochemical polishing process, the effects of applied voltage, electrolyte concentration, and polishing time on the three roughness parameters were examined. Besides the Ra, the influence of Ry and Rz on the bacterial adhesion was found to be very significant. By using the electrochemical process with a suitable polishing condition, the Ry and Rz were substantially reduced compared to the mechanically polished surface with the similar level of Ra. The amount of bacteria on the electrochemically polished surface was also lower than the mechanical one by 25% on average. © 2020, © 2020 Taylor & Francis Group, LLC.
Keywords
electrochemical polishing
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